YCS Oragon Arc Pad Shenlong BGA Stencil for Soldering
Price Statistics (30 days)
Original title: YCS Oragon Arc Pad Shenlong Curved Universal BGA Stencil Tin Planting Insulation Base Cell Phones CPU IC Soldering BGA Reballing
AI descripion: The YCS Oragon Arc Pad Shenlong BGA Stencil is a specialized tool used for precise soldering of CPU ICs in cell phones. It features a curved design that accommodates various application needs, enhancing the reballing process. This stencil is intended for use in tin planting and insulation base tasks, making it a suitable choice for technicians engaged in electronic repair and maintenance.
- Category: Tool Sets
- Tags: bga stencil, soldering tool
| Lovest | Highest | Curent | Average |
|---|---|---|---|
| 5.04 € | 5.29 € | 5.26 € | 5.19 € |
Price analysis
The current price of 5.26 € is very close to the average price of 5.19 € over the last 30 days, while the lowest recorded price was 5.04 € and the highest reached 5.29 €. This indicates that the current price is above average, suggesting that it may be a less favorable time to buy.
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