MECHANIC La-03 White Anti-Blowout Reballing Pad
Price Statistics (30 days)
Original title: MECHANIC La-03 White Glass Anti-Blowout BGA Reballing Pad 20x20mm for CPU GPU Chip Solder Ball Phone Motherboard Repair Tool
AI descripion: The MECHANIC La-03 White Glass Anti-Blowout BGA Reballing Pad is a tool used in the repair of CPU and GPU chips. Measuring 20x20mm, it assists in the application of solder balls on phone motherboards. The anti-blowout feature helps maintain stability during the reballing process, ensuring precision and effectiveness in repairs.
- Category: Mobile Phone Parts
- Tags: repair tool, reballing pad
| Lovest | Highest | Curent | Average |
|---|---|---|---|
| 4.70 € | 4.70 € | 4.70 € | 4.70 € |
Price analysis
The current price of 4.70 € is equal to the average price of 4.70 € over the last 30 days, while the lowest recorded price was 4.70 € and the highest reached 4.70 €. This indicates that the current price is unchanged during this period, suggesting that it may be a neutral time to buy.
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